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TGDDM/DICY epoxy cure kinetics and properties
FTIR and non-isothermal DSC show TGDDM/dicyandiamide cures in two autocatalytic stages, then a stiff, low-water-uptake network.
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What epoxy and hardener are studied?
Tetrafunctional TGDDM with latent dicyandiamide (DICY).
Source: Reaction mechanism, cure behavior and properties of a multifunctional epoxy resin, TGDDM, with latent curing agent dicyandiamide · DOI · quote verified
Which IR band tracks epoxy consumption?
906 cm–1 (oxirane).
Source: Reaction mechanism, cure behavior and properties of a multifunctional epoxy resin, TGDDM, with latent curing agent dicyandiamide · DOI · quote verified
What happens to DICY N–H bands?
Sharp 3426 and 3385 cm–1 amines become a broad ~3450 cm–1 OH.
Source: Reaction mechanism, cure behavior and properties of a multifunctional epoxy resin, TGDDM, with latent curing agent dicyandiamide · DOI · quote verified
Late-cure carbonyl that appears?
Amide C=O at 1687 cm–1 as nitrile is consumed.
Source: Reaction mechanism, cure behavior and properties of a multifunctional epoxy resin, TGDDM, with latent curing agent dicyandiamide · DOI · quote verified
How many DSC cure regimes?
Two, split at fractional conversion α = 0.45.
Source: Reaction mechanism, cure behavior and properties of a multifunctional epoxy resin, TGDDM, with latent curing agent dicyandiamide · DOI · quote verified
Kissinger Ea values?
69.7 kJ mol–1 then 88.7 kJ mol–1.
Source: Reaction mechanism, cure behavior and properties of a multifunctional epoxy resin, TGDDM, with latent curing agent dicyandiamide · DOI · quote verified
Is total ΔH heating-rate dependent?
No; 797–867 J g–1 within 5% error.
Source: Reaction mechanism, cure behavior and properties of a multifunctional epoxy resin, TGDDM, with latent curing agent dicyandiamide · DOI · quote verified
When does diffusion take over?
Deep conversion, α > 0.85, after Ea peaks at 98.1 kJ mol–1.
Source: Reaction mechanism, cure behavior and properties of a multifunctional epoxy resin, TGDDM, with latent curing agent dicyandiamide · DOI · quote verified
High-temperature adhesive strength?
12.6 MPa tensile/shear at 200 °C, better than DGEBA/DICY.
Source: Reaction mechanism, cure behavior and properties of a multifunctional epoxy resin, TGDDM, with latent curing agent dicyandiamide · DOI · quote verified
Dielectric constant at 1 MHz?
3.26 versus 3.17 for DGEBA/DICY.
Source: Reaction mechanism, cure behavior and properties of a multifunctional epoxy resin, TGDDM, with latent curing agent dicyandiamide · DOI · quote verified
Water uptake versus DGEBA/DICY?
0.41% versus 0.47%—TGDDM is slightly drier.
Source: Reaction mechanism, cure behavior and properties of a multifunctional epoxy resin, TGDDM, with latent curing agent dicyandiamide · DOI · quote verified